IEC 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
| Get this standard | Prices exclude GST | |
|---|---|---|
| PDF ( Single user document) |
$278.26 NZD
|
|
| HardCopy |
$316.52 NZD
|
|
| Networkable PDF |
Price varies
|
Keep me up-to-date
Sign up to receive updates when there are changes to this standard
Related Information
Similar Standards
-
BS EN 160200-2:1998
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality, Index of test methods
-
BS EN 60068-2-58:2015+A1:2018
Environmental testing, Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
-
BS EN 60068-2-69:2017+A1:2019
Environmental testing, Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
-
BS EN 60068-2-83:2011
Environmental testing, Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste