BS EN 60749-22:2003
Current
Date published:
Semiconductor devices. Mechanical and climatic test methods, Bond strength
Related Information
29.100.10 Magnetic components
31.080.01 Semiconductor devices in general
Similar Standards
-
BS 3934-5:1997
Mechanical standardization of semiconductor devices, Recommendations applying to tape automated bonding (TAB) of integrated circuits
-
BS 4727-1:Group 07:1991
Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms. Terms common to power, telecommunications and electronics, Magnetic materials and components
-
BS 4999-147:1988
General requirements for rotating electrical machines, Specification for dimensions of brushes and brush-holders for electrical machinery
-
BS 5347:1976
Specification for silicon-iron strip-wound cores for use in transformers and inductors for telecommunications and electronic equipment