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BS 3934-5:1997

Current Date published:

Mechanical standardization of semiconductor devices, Recommendations applying to tape automated bonding (TAB) of integrated circuits

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

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Pages: 38

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Pages: 38

Previous versions

BS 3934-5:1997

Get this standard Prices exclude GST
PDF ( Single user document)
$498.26 NZD
HardCopy
$539.13 NZD

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