BS 3934-5:1997
Current
Date published:
Mechanical standardization of semiconductor devices, Recommendations applying to tape automated bonding (TAB) of integrated circuits
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
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Related Information
31.080.01 Semiconductor devices in general
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BS 3934-5:1997
Get this standard
Prices exclude GST
PDF
( Single user document)
$538.00 NZD
HardCopy
$586.00 NZD