ISO 9453:2020
Soft solder alloys — Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
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Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
5.1 General
5.2 Unit of product
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) Comparison between alloy numbers in this document and short names and chemical compositions according to IEC 61190-1-3
Bibliography
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Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
5.1 General
5.2 Unit of product
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) Comparison between alloy numbers in this document and short names and chemical compositions according to IEC 61190-1-3
Bibliography