ISO 9453:1990
Withdrawn
Date published:
Soft solder alloys — Chemical compositions and forms
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.
| Get this standard | Prices exclude GST | |
|---|---|---|
| PDF ( Single user document) |
$126.00 NZD
|
|
| Networkable PDF |
Price varies
|
Keep me up-to-date
Sign up to receive updates when there are changes to this standard
Related Information
25.160.50 Brazing and soldering
Similar Standards
-
BS 5245:1975
Specification for phosphoric acid based flux for soft soldered joints in stainless steel
-
BS EN 12797:2000
Brazing. Destructive tests of brazed joints
-
BS EN 12799:2000
Brazing. Non-destructive examination of brazed joints
-
BS EN 13134:2000
Brazing. Procedure approval
ISO 9453:1990
Get this standard
Prices exclude GST
PDF
( Single user document)
$126.00 NZD
Networkable PDF
Price varies