IEC 60191-6-22:2012
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Date published:
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
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31.080.01 Semiconductor devices in general
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IEC 60191-6-22:2012
Get this standard
Prices exclude GST
PDF
( Single user document)
$180.90 NZD
HardCopy
$180.90 NZD
Networkable PDF
Price varies