Similar Standards

• BS 3934-5:1997

  Mechanical standardization of semiconductor devices, Recommendations applying to tape automated bonding (TAB) of integrated circuits

• BS 7241:1989

  Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus

• BS EN 153000:1998

  Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)

• BS EN 60068-2-13:1999

  Environmental testing. Test methods, Tests. Test M. Low air pressure