CONTENTS
1 Scope
2 Normative references
3 Terms and definitions
3.1 General terms
3.2 Constructional units of ASSEMBLIES
3.3 External design of ASSEMBLIES
3.4 Structural parts of ASSEMBLIES
3.5 Conditions of installation of ASSEMBLIES
3.6 Insulation characteristics
3.7 Protection against electric shock
3.8 Characteristics
3.9 Verification
3.10 Manufacturer/user
4 Symbols and abbreviations
5 Interface characteristics
5.1 General
5.2 Voltage ratings
5.3 Current ratings
5.4 Rated diversity factor (RDF)
5.5 Rated frequency (fn)
5.6 Other characteristics
6 Information
6.1 ASSEMBLY designation marking
6.2 Documentation
6.3 Device and/or component identification
7 Service conditions
7.1 Normal service conditions
7.2 Special service conditions
7.3 Conditions during transport, storage and installation
8 Constructional requirements
8.1 Strength of materials and parts
8.2 Degree of protection provided by an ASSEMBLY enclosure
8.3 Clearances and creepage distances
8.4 Protection against electric shock
8.5 Incorporation of switching devices and components
8.6 Internal electrical circuits and connections
8.7 Cooling
8.8 Terminals for external conductors
9 Performance requirements
9.1 Dielectric properties
9.2 Temperature rise limits
9.3 Short-circuit protection and short-circuit withstand strength
9.4 Electromagnetic compatibility (EMC)
10 Design verification
10.1 General
10.2 Strength of materials and parts
10.3 Degree of protection of ASSEMBLIES
10.4 Clearances and creepage distances
10.5 Protection against electric shock and integrity of protective circuits
10.6 Incorporation of switching devices and components
10.7 Internal electrical circuits and connections
10.8 Terminals for external conductors
10.9 Dielectric properties
10.10 Verification of temperature rise
10.11 Short-circuit withstand strength
10.12 Electromagnetic compatibility (EMC)
10.13 Mechanical operation
11 Routine verification
11.1 General
11.2 Degree of protection of enclosures
11.3 Clearances and creepage distances
11.4 Protection against electric shock and integrity of protective circuits
11.5 Incorporation of built-in components
11.6 Internal electrical circuits and connections
11.7 Terminals for external conductors
11.8 Mechanical operation
11.9 Dielectric properties
11.10 Wiring, operational performance and function
Annex
Annex A (normative) Minimum and maximum cross-section of copper conductorssuitable for connection to terminals for external conductors (see 8.8)
Annex B (normative) Method of calculating the cross-sectional area of protectiveconductors with regard to thermal stresses due to currents of short duration
Annex C (informative) User information template
Annex D (informative) Design verification
Annex E (informative) Rated diversity factor
Annex F (normative) Measurement of clearances and creepage distances
Annex G (normative) Correlation between the nominal voltage of the supply systemand the rated impulse withstand voltage of the equipment
Annex H (informative) Operating current and power loss of copper conductors
Annex I (Void)
Annex J (normative) Electromagnetic compatibility (EMC)
Annex K (normative) Protection by electrical separation
Annex L (informative) Clearances and creepage distances for North American region
Annex M (informative) North American temperature rise limits
Annex N (normative) Operating current and power loss of bare copper bars
Annex O (informative) Guidance on temperature rise verification
Annex P (normative) Verification of the short-circuit withstand strength of busbarstructures by comparison with a tested reference design by calculation
Bibliography
Figure
Figure E.1 – Typical ASSEMBLY
Figure E.2 – Example 1: Table E.1 – Functional unit loading for an ASSEMBLY with arated diversity factor of 0,8
Figure E.3 – Example 2: Table E.1 – Functional unit loading for an ASSEMBLY with arated diversity factor of 0,8
Figure E.4 – Example 3: Table E.1 – Functional unit loading for an ASSEMBLY with arated diversity factor of 0,8
Figure E.5 – Example 4: Table E.1 – Functional unit loading for an ASSEMBLY with arated diversity factor of 0,8
Figure E.6 – Example of average heating effect calculation
Figure E.7 – Example graph for the relation between the equivalent RDF and theparameters at intermittent duty at t1 = 0,5 s, I1 = 7*I2 at different cycle times
Figure E.8 – Example graph for the relation between the equivalent RDF and theparameters at intermittent duty at I1 = I2 (no starting overcurrent)
Figure F.1 – Measurement of ribs
Figure J.1 – Examples of ports
Figure O.1 – Temperature rise verification methods
Figure P.1 – Tested busbar structure (TS)
Figure P.2 – Non tested busbar structure (NTS)
Figure P.3 – Angular busbar configuration with supports at the corners
Table
Table 1 – Minimum clearances in air a (8.3.2)
Table 2 – Minimum creepage distances (8.3.3)
Table 3 – Cross-sectional area of a copper protective conductor (8.4.3.2.2)
Table 4 – Conductor selection and installation requirements (8.6.4)
Table 5 – Minimum terminal capacity for copper protective conductors (PE, PEN) (8.8)
Table 6 – Temperature-rise limits (9.2)
Table 7 – Values for the factor n a (9.3.3)
Table 8 – Power-frequency withstand voltage for main circuits (10.9.2)
Table 9 – Power-frequency withstand voltage for auxiliary and control circuits (10.9.2)
Table 10 – Impulse withstand test voltages (10.9.3)
Table 11 – Copper test conductors for rated currents up to 400 A inclusive(10.10.2.3.2)
Table 12 – Copper test conductors for rated currents from 400 A to 4 000 A(10.10.2.3.2)
Table 13 – Short-circuit verification by comparison with a reference design: check list(10.5.3.3, 10.11.3 and 10.11.4)
Table 14 – Relationship between prospective fault current and diameter of copper wire
Table A.1 – Cross-section of copper conductors suitable for connection to terminalsfor external conductors
Table B.1 – Values of k for insulated protective conductors not incorporated in cables,or bare protective conductors in contact with cable covering
Table C.1 – Template
Table D.1 – List of design verifications to be performed
Table E.1 – Examples of loading for an ASSEMBLY with a rated diversity factor of 0,8
Table E.2 – Example of loading of a group of circuits (Section B – Figure E.1) with arated diversity factor of 0,9
Table E.3 – Example of loading of a group of circuits (Sub-distribution board – FigureE.1) with a rated diversity factor of 0,9
Table F.1 – Minimum width of grooves
Table G.1 – Correspondence between the nominal voltage of the supply system andthe equipment rated impulse withstand voltage
Table H.1 – Operating current and power loss of single-core copper cables with apermissible conductor temperature of 70 °C (ambient temperature inside theASSEMBLY: 55 °C)
Table H.2 – Reduction factor k1 for cables with a permissible conductor temperatureof 70 °C (extract from IEC 60364-5-52:2009, Table B.52.14
Table J.1 – Tests for EMC immunity for environment A (see J.10.12.1
Table J.2 – Tests for EMC immunity for environment B (see J.10.12.1
Table J.3 – Acceptance criteria when electromagnetic disturbances are present
Table K.1 – Maximum disconnecting times for TN systems
Table L.1 – Minimum clearances in air
Table L.2 – Minimum creepage distances
Table M.1 – North American temperature rise limits
Table N.1 – Operating current and power loss of bare copper bars with rectangularcross-section, run horizontally and arranged with their largest face vertical, frequency50 Hz to 60 Hz (ambient temperature inside the ASSEMBLY: 55 °C, temperature of theconductor 70 °C)
Table N.2 – Factor k4 for different temperatures of the air inside the ASSEMBLY and/orfor the conductors
