BS 2011-2.1Td:1990
Withdrawn
Date published:
Environmental testing. Tests, Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Procedure for testing the effects of soldering using a solder bath. Applicable only to products designed to withstand short term immersion in molten solder.
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19.040 Environmental testing
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