ISO 9453:2020
Soft solder alloys — Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
| Get this standard | Prices exclude GST | |
|---|---|---|
| PDF ( Single user document) |
$179.13 NZD
|
|
| HardCopy |
$214.78 NZD
|
|
| Networkable PDF |
Price varies
|
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
5.1 General
5.2 Unit of product
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) Comparison between alloy numbers in this document and short names and chemical compositions according to IEC 61190-1-3
Bibliography
Previous versions
Keep me up-to-date
Register to receive notifications when updates are made to this standard.
Related Information
Similar Standards
-
BS 5245:1975
Specification for phosphoric acid based flux for soft soldered joints in stainless steel
-
BS EN 12797:2000
Brazing. Destructive tests of brazed joints
-
BS EN 12799:2000
Brazing. Non-destructive examination of brazed joints
-
BS EN 13134:2000
Brazing. Procedure approval
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
5.1 General
5.2 Unit of product
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) Comparison between alloy numbers in this document and short names and chemical compositions according to IEC 61190-1-3
Bibliography