ISO 9453:2006
Withdrawn
Date published:
Soft solder alloys — Chemical compositions and forms
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
- tin-antimony;
- tin-bismuth;
- tin-copper, with and without silver;
- tin-indium, with and without silver and bismuth;
- tin-silver, with and without copper and bismuth;
- tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.
| Get this standard | Prices exclude GST | |
|---|---|---|
| PDF ( Single user document) |
$118.26 NZD
|
|
| Networkable PDF |
Price varies
|
Keep me up-to-date
Register to receive notifications when updates are made to this standard.
Related Information
25.160.50 Brazing and soldering
Similar Standards
-
BS 5245:1975
Specification for phosphoric acid based flux for soft soldered joints in stainless steel
-
BS EN 12797:2000
Brazing. Destructive tests of brazed joints
-
BS EN 12799:2000
Brazing. Non-destructive examination of brazed joints
-
BS EN 13134:2000
Brazing. Procedure approval
ISO 9453:2006
Get this standard
Prices exclude GST
PDF
( Single user document)
$118.26 NZD
Networkable PDF
Price varies