Skip to main content

BS 5909:1980

Current Date published:

Method for scale adhesion test for oxygen-free copper

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

Get this standard Prices exclude GST
PDF ( Single user document)
$223.78 NZD
HardCopy
$223.78 NZD
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Pages: 6

Related Information

Similar Standards

  • BS 6285:1982

    Method for the macrographic examination of steel by sulphur print (Baumann method)

  • BS 6286:1982

    Methods of measurement of total or effective thickness of thin surface-hardened layers in steel

  • BS 6533:1984

    Guide to macroscopic examination of steel by etching with strong mineral acids

  • BS 7590:1992

    Method for statistically estimating the volume fraction of phases and constituents by systematic manual point counting with a grid

Preview only close
Prev {{ page }}/ {{ numPages }} Next
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Pages: 6

BS 5909:1980

Get this standard Prices exclude GST
PDF ( Single user document)
$223.78 NZD
HardCopy
$223.78 NZD

Request to add this standard to your subscription

BS 5909:1980

Price varies
Online library subscription

Click "Send request for subscription" to request for your Account Administrator to add this standard to your subscripiton.

Comment

Cancel