Skip to main content

IEC 61760-4:2015+AMD1:2018 CSV

Current Date published:

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering. This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.

Get this standard Prices exclude GST
PDF ( Single user document)
$456.19 NZD
HardCopy
$456.19 NZD
Networkable PDF
Price varies
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Pages: 132

Keep me up-to-date

Sign up to receive updates when there are changes to this standard

Related Information

Similar Standards

  • BS EN 160200-2:1998

    Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality, Index of test methods

  • BS EN 60068-2-58:2015+A1:2018

    Environmental testing, Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

  • BS EN 60068-2-69:2017+A1:2019

    Environmental testing, Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

  • BS EN 60068-2-83:2011

    Environmental testing, Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Preview only close
Prev {{ page }}/ {{ numPages }} Next
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Pages: 132

IEC 61760-4:2015+AMD1:2018 CSV

Get this standard Prices exclude GST
PDF ( Single user document)
$456.19 NZD
HardCopy
$456.19 NZD
Networkable PDF
Price varies

Request to add this standard to your subscription

IEC 61760-4:2015+AMD1:2018 CSV

Price varies
Online library subscription

Click "Send request for subscription" to request for your Account Administrator to add this standard to your subscripiton.

Cancel