Skip to main content

IEC 60749-20-1:2019

Current Date published:

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

IEC 60749-20-1:2019 is available as IEC 60749-20-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition:
- updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions;
- addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

Get this standard Prices exclude GST
PDF ( Single user document)
$506.09 NZD
HardCopy
$553.04 NZD
Networkable PDF
Price varies
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Pages: 82

Keep me up-to-date

Register to receive notifications when updates are made to this standard.

Related Information

Similar Standards

  • BS 3934-5:1997

    Mechanical standardization of semiconductor devices, Recommendations applying to tape automated bonding (TAB) of integrated circuits

  • BS 7241:1989

    Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus

  • BS EN 153000:1998

    Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)

  • BS EN 60068-2-13:1999

    Environmental testing. Test methods, Tests. Test M. Low air pressure

Preview only close
Prev {{ page }}/ {{ numPages }} Next
Preview only close
Prev {{ page }}/ {{ numPages }} Next
Pages: 82

IEC 60749-20-1:2019

Get this standard Prices exclude GST
PDF ( Single user document)
$506.09 NZD
HardCopy
$553.04 NZD
Networkable PDF
Price varies

Request to add this standard to your subscription

IEC 60749-20-1:2019

Price varies
Online library subscription

Click "Send request for subscription" to ask your Account Administrator to add this standard to your subscripiton.

Cancel