BS 3934-5:1992
Withdrawn
Date published:
Mechanical standardization of semiconductor devices, Recommendations for tape automated bonding (TAB) of integrated circuits
Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or 'chip carriers'.
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Related Information
31.080.01 Semiconductor devices in general
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BS 3934-5:1992
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